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Thermal Pad SY-GP 300S25

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Product Detail

    Features and Benefits:
    Thermal conductivity 3.0 W/m•k
    Variables can be up to 90%, deformation force is very low.
    High stickiness surface, reducing the contact thermal resistance
    Flame Retardant Grade: V-0 

    SY-GP 300S25 thermal pad has very low deformation force, the shape variable can be up to 90%,it has perfect heat conduction performance and compliance, it can fill the gap and conduct the heat from the generation part to radiation part. 

    SY-GP 300S25 thermal pad has inherent adhesion features, dispense with adhesion layer, meanwhile it has excellent wettability and can cover the tiny uneven surface so that make the mating parts fully contacted,  thus improve the efficiency of the heat conduction. The thickness can be specially customized according to your demand. You can also choose the products with adhesive film or single side sticky. 

    Configurations Available:
    Standard size : 470×470 mm, and can die-cutted according to customer demand
    Thickness available : 0.50~8.0 mm
    Can be laminated with adhesive film according to customer demand.

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Zhejiang Saintyear Electronic Technologies Co., LTD

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